These Oerlikon Leybold SL300 purge and vent valve has a 12 sccm flow rate and the valve may be either connected directly or using a M8 – DN16KF adapter. The Oerlikon Leybold SL300 turbo pumps are equipped with a purge and venting gas connection which has been blanked off as a standard with a M8 closure screw. When the controller is switched off and during power failure the venting valve vents the pump and the foreline and thus keeps oil vapor from diffusing back from the rough pump. A choke nozzle in the vent port ensures that the pump is not vented too fast.
The TURBOVAC SL pumps are suitable for pumping air and clean gases. If reactive gases in low concentrations must be pumped operate the turbo pump with purge gas. For venting and as the purge gas we recommend inert gases like nitrogen or argon. The temperature of these gases should be between 5° C and 80° C , max. relative humidity should not exceed 10 ppm. Consider the additional purge gas flow when selecting a suitable backing pump. We recommend a purge gas flow of 0.2 mbar·l/s (12 sccm) with Nitrogen. The pressure in the pump must not exceed 1200 mbar (0.2 bar over-atmosphere).
These new generation of SL TURBOVAC turbomolecular pumps have improved mechanical rotor suspension and compound stage excels through a new compact design, improved vacuum performance and a standardized accessories program. The SL series pumps are among the quietest turbo pumps on the market today, the SL 300 pumps have less than 49 dB(A). The Oerlikon Leybold SL-300 with ISO-100 inlet flange has a 270 l/s pumping speed for nitrogen, can have an ultimate pressure as low as 7.5×10 Torr when backed with oil sealed rotary vane pump, and has a KF-16 roughing flange.
The Oerlikon Leybold TURBOVAC SL turbomolecular pumps are highly flexible regarding the controller-mounting position, which can be placed onboard, as a bench-top unit or in a rack. In addition, the pumps can be mounted in virtually any position and at any angle. The turbomolecular pumps from the TURBOVAC SL product family are designed to handle the most advanced and demanding applications and requirements in research and industry and many more applications.